Digital - ASIC Design Automation & Integration Engineer
TLDR
Define ASIC signoff criteria, automate RTL quality pipelines, and develop LLM-based tooling to turn lint and CDC violations into actionable reviews.
Lint / CDC / Synthesis Quality · IP & Chip Integration · AI-Augmented Design Flows · CI/CD for RTL
On-Site Monday-Friday - Bay Area, CA / Vancouver, BC / Toronto, ON
Full-Time - Equity Participation - Comprehensive Benefits
ABOUT THE ROLEEliyan is the chiplet interconnect pioneer behind NuLink, the industry's most efficient chiplet-to-chiplet PHY technology. With Series C funding from leading hyperscalers and AI infrastructure providers, we are scaling our digital design organization to support multiple concurrent IP programs across advanced process nodes.
We are looking for an engineer who can own the intersection of design quality, automation, and design integration. In this role you will define and enforce signoff criteria for lint, CDC, and synthesis across all active programs, build the waiver management and tracking infrastructure, and develop AI-augmented tooling that turns thousands of tool violations into actionable, designer-ready reviews. You will report into the digital design team and work directly alongside RTL designers.
Design quality and automation are the core of this role. IP and chip-level integration ownership is scope you can grow into as you ramp — we're looking for someone who wants it.
KEY RESPONSIBILITIES
Design Quality & Signoff
IP & Chip Integration
Flow Automation and CIC
AI-Augmented Tooling
- Develop LLM-based violation triage pipelines that classify lint and CDC output, suppress known-benign patterns, and surface real issues with context.
- Build automated pull requests with violations pre-filtered, grouped, and annotated for designer review.
- Implement spec-to-RTL consistency checking and CI-integrated documentation generation using LLM-driven pipelines.
- Benchmark AI output quality, measure false-negative rates, and establish guardrails the design team can trust.
MINIMUM REQUIREMENTS
PREFERRED QUALIFICATIONS
Benefits
Equity Compensation
Equity Participation
Health Insurance
Comprehensive Benefits
Visa Sponsorship
visa sponsorship may be considered for exceptional candidates
Eliyan develops NuLink, an innovative die-to-die chiplet interconnect fabric specifically designed for hyperscale AI infrastructure. Catering to the rapidly evolving semiconductor industry, Eliyan focuses on delivering high-performance, manufacturable chiplet solutions that enhance power efficiency and design flexibility.
- Founded
- Founded 2021
- Employees
- 51-200 employees
- Industry
- semiconductors
- Total raised
- $150M raised
- Last funding
- Raised January 2026