KandouAI
KandouAI

Firmware Engineer Lead

TLDR

Develop embedded firmware for PCIe-based AI hardware, enabling high-speed interconnects and HW-SW integration in data-center-grade systems.

At Kandou, we are redefining the economics of AI infrastructure. Our mission is to democratise AI by significantly reducing the Total Cost of Ownership (TCO) of hardware systems — a critical barrier to scalable adoption.


Our proprietary MIMO-over-copper technology powers a high-performance, chiplet-based AI memory fabric that is both scalable and energy-efficient. Unlike traditional interconnects, our solution reduces power consumption significantly while preserving high bandwidth and ultra-low latency — unlocking unprecedented efficiency for AI training and inference at scale.


Kandou’s architecture is not just an incremental improvement — it’s a foundational shift in how AI hardware is built for the future.


We are actively seeking a Firmware Engineer Lead, based in Pune.

 

Required Experience:

  • Experience developing embedded firmware for PCIe products.
  • High level of proficiency in C (preferred) or C++, including development of C-based SDKs.
  • High level of proficiency in Python for automating pre-processors/post-processors.
  • Working knowledge of software/firmware build environments, gcc/Make, Doxygen, and GitHub.
  • Hands-on experience with Server, Storage, and/or Networking equipment (e.g. Network Switches).
  • Familiarity with SoC interfaces to common IP blocks such as PCIe Controllers, NVME Controllers, AMBA/AHB interfaces, on-chip memory interfaces, and other similar interfaces
  • Direct experience working on products with high-speed interfaces common in Data Center equipment: PCI- Express (Gen-3 and above), 100/400G Ethernet, Infiniband, NVMe, etc


Preferred Experience:

  • Experience developing firmware to execute in on-chip microcontrollers as well as C-language SDKs to execute on system management controllers (e.g. BMC)
  • Experience with industry forums and collaboration workgroups such as OCP and OpenBMC
  • Experience with storage or SSD firmware, including NVMe, PCIe, CXL or flash management concepts.
  • Hands-on experience with simulation or virtual platform–based development (e.g., VDK, QEMU, or similar)


Qualifications:

  • Strong academic and technical background in electrical engineering. At a minimum, a Bachelor’s in EE or Computer Science is required, and a Master’s is preferred.
  • Minimum 12+ years’ (Lead/Architect) experience supporting or developing complex SoC/silicon products for Server, Storage, and/or Networking applications
  • Experience developing firmware to execute in on-chip microcontrollers as well as C-language software development kits (SDKs) to execute on system management controllers (e.g. BMC).
  • Experience working with logic designers to architect and verify HW-SW interfaces on complex SoCs.



    If this is the role you have been looking for and you want to be part of a growing Company, with an exciting future then we would really love to hear from you. Together We Kandou It!


    https://www.kandou.ai/

    KandouAI is transforming AI infrastructure by reducing the Total Cost of Ownership of hardware systems, making scalable AI adoption more accessible. Our proprietary MIMO-over-copper technology delivers a high-performance, chiplet-based memory fabric that is both energy-efficient and ultra-fast, fundamentally changing the way AI hardware is constructed for the future.

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