Optical Packaging/Component Engineer
TLDR
Develop and test packaging solutions for multi-lane optical interconnects.
Avicena is a privately held company developing microLED based ultra-low power high bandwidth interconnects for chip-to-chip communications. This technology will revolutionize High-Performance (HPC) and Cloud computing, as well as other industries where low power interconnects are critical like camera sensors, autonomous vehicles, and aerospace. Avicena is headquartered in Sunnyvale, California with a development center in Edinburgh, Scotland. The company was founded in 2019 by leading technologists from the optical networking industry with a track record of delivering breakthrough products. (www.avicena.tech)
About the role:
Develop and test packaging solutions for multi-lane optical interconnects.
- Design and test optical sub-assemblies with arrays of optical fibers.
- Design multi-fiber optical connectors and work with external vendors to develop connector eco-system.
- Design micro-array assembly process, fixture and tooling development.
- Work with optical fibers, optical launch optimization and optical loss testing.
- Develop mechanical/optomechanical test procedures.
- Perform micron level assembly techniques.
- Measure material properties and interactions (e.g. epoxy selection, CTE, stress)
- Component reliability and qualification testing.
Qualifications:
- 5+ years’ experience in Opto-Mechanical or Optical Packaging field.
- M.S. degree or higher in Opto-Mechanical Engineering, Physics, or equivalent field.
- Preferred experience with Optical Transceiver assembly, Silicon Photonics or Co-Packaged Optics
- Hands-on expertise with mechanical design software (e.g. Solidworks) and mechanical modeling simulations
- Experience with optical modelling software (e.g. Zemax, LightTools) is an asset
- Knowledge of micro-replication techniques and polymer molding is an asset
- Ability to work independently in a fast-paced startup environment
- Excellent teamwork and interpersonal/communication skills within the company and with partners, customers, and consultants.
AvicenaTech develops microLED-based ultra-low power high bandwidth interconnects designed for chip-to-chip communications. Targeting markets such as High-Performance Computing, Cloud computing, and industries requiring low power interconnects, like autonomous vehicles and aerospace, AvicenaTech's innovative technology aims to significantly enhance performance across multiple sectors.