RO61 NXP Semiconductors Romania SRL
Packaging Development Engineer
TLDR
Lead packaging development projects, design experiments, analyze data, qualify and transfer to high-volume production, and share lessons across sites.
Responsibilities:
- Lead, plan, and execute projects related to process assembly development and validation
- Design, execute, and analyze process related experiments
- Use software to analyze data including statistical analysis
- Solve process issues using creative problem solving techniques
- Create process recipe for packaging development, qualify and transfer for high volume production
- Set up new specifications and procedures for production
- Initiate sharing of lesson learnt and best practices among manufacturing sites
- Lead / participate in Task Force Teams
- Identify risks and actions for risk mitigation manufacturing operation
- Lead / support process qualification activities
Requirements:
- Minimum Bachelor’s degree in Engineering or Sciences (or related field). Master or PhD holder is preferred.
- Good aptitude in statistical data analysis and problem solving skills
- Must exhibit pro-activeness in leading process characterization work, ability to take on new challenges an embrace changes
- Basic knowledge of project planning and experience in driving small projects
- Excellent communication and presentation skills
- Must demonstrate good initiative, collaboration, and interpersonal skills working with cross functional teams
- Must be committed to meet process / project deadlines and commitments
NXP Semiconductors Romania SRL develops secure connectivity solutions that power embedded applications across various sectors, including automotive, industrial, IoT, mobile, and communication infrastructure. As a leader in the semiconductor industry, NXP is committed to driving innovation for a smarter and more sustainable world.