KandouAI
KandouAI

Software Architect

TLDR

Lead CMIS 5.x stack implementation, hyperscaler interop, and telemetry pipelines for a scalable, chiplet-based AI memory fabric.

At Kandou, we are redefining the economics of AI infrastructure. Our mission is to democratise AI by significantly reducing the Total Cost of Ownership (TCO) of hardware systems — a critical barrier to scalable adoption.


Our proprietary MIMO-over-copper technology powers a high-performance, chiplet-based AI memory fabric that is both scalable and energy-efficient. Unlike traditional interconnects, our solution reduces power consumption significantly while preserving high bandwidth and ultra-low latency — unlocking unprecedented efficiency for AI training and inference at scale.


Kandou’s architecture is not just an incremental improvement — it’s a foundational shift in how AI hardware is built for the future.


We are actively seeking a Software Architect either based in Hyderabad OR Bangalore.

Responsibilities:

  • Architect CMIS 5.x stack (DataPath State Machine, VDM, I2C/MCTP, FW-SW interface)
  • Lead host interop tests for hyperscalers (Meta, AWS, etc.), build test matrix and regression suite
  • Develop manufacturing test orchestration (ATE integration, yield analytics, on-chip stimulus)
  • Build telemetry pipeline from FW to host/cloud (formats, compression, SDK APIs)
  • Own customer SDK and tools (C/Python, CLI, log analysis), release management
  • Ensure standards compliance (CMIS 5.x, OSFP MSA, SFF-8024, OIF)
  • Travel: Up to 25% (customer engagement, manufacturing, standards)


Skills:

  • Good knowledge of C/C++, Python, systems language (Go/Rust); CI/CD, conformance tests 
  • Good knowledge of I2C/MCTP, SFF-8024, vendor extensions
  • Good understanding of standards implementation (OIF, SFF, IEEE mgmt-plane)
  • Good knowledge of architecture documentation (SHALL/MUST, REQ traceability)
  • Self-motivated, with strong sense of ownership and responsibility
  • Good communication and reporting skills


Experience:

  • Principal / Senior Staff (8-10 years post-degree)
  • 8-10 years high-speed interconnect software (module SW, management, test, SDK)
  • CMIS 4.x/5.x implementation and OSFP MSA experience
  • Hyperscaler interop with NIC/switch ASICs (Nvidia, Broadcom)
  • Test software architecture with ATE/yields
  • Manufacturing and field support experience


Education:

  • BS in Electrical Engineering, Computer Engineering, or Computer Science (MS preferred)


If this is the role you have been looking for and you want to be part of a growing Company, with an exciting future then we would really love to hear from you. Together We Kandou It!


https://www.kandou.ai/






Benefits

Travel allowance

Travel allowance: Up to 25% for customer engagement, manufacturing, standards

KandouAI is transforming AI infrastructure by reducing the Total Cost of Ownership of hardware systems, making scalable AI adoption more accessible. Our proprietary MIMO-over-copper technology delivers a high-performance, chiplet-based memory fabric that is both energy-efficient and ultra-fast, fundamentally changing the way AI hardware is constructed for the future.

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