RO61 NXP Semiconductors Romania SRL
Wire Bond Equipment Engineer
TLDR
Oversee wire bond equipment overhaul, maintenance, and automation initiatives to maximize uptime, reliability, and productivity.
Responsibilities:
- Lead and manage wire bond equipment overhaul and rebuild activities to ensure maximum machine uptime and reliability.
- Develop and implement preventive maintenance programs and calibration procedures for wire bond machine.
- Drive continuous improvement initiatives focused on equipment performance, process optimization, and quality enhancement.
- Analyze equipment downtime and root causes; implement corrective actions to minimize recurrence.
- Collaborate with cross-functional teams to support production goals, improve equipment utilization, and meet customer quality requirements.
- Develop innovative solutions and automation systems to enhance machine connectivity, reduce manual intervention, and improve operational efficiency.
- Provide technical training and mentorship to engineers on wire bond equipment troubleshooting, overhaul, and process control.
- Ensure compliance with environmental, safety, and quality standards in all equipment-related activities.
- Lead projects that deliver measurable improvements in productivity, cost reduction, and quality performance.
Qualifications:
- Education: Bachelor’s degree in Electronics, Electrical, Mechanical, or related Engineering field.
- Experience: Minimum 7 years of hands-on experience in wire bond equipment engineering or semiconductor assembly operations.
- Proven expertise in wire bond machine platforms.
- Strong background in machine overhaul, rebuild, calibration, preventive, and predictive maintenance.
- Demonstrated ability to manage major repairs, restoration, and equipment qualification.
- Solid understanding of quality systems, SPC, and root cause analysis for equipment-related issues.
- Experience in continuous improvement methodologies (Lean, Six Sigma) and driving cost-reduction projects.
- Ability to develop and implement automation and innovative solutions for equipment and process improvement.
- Excellent analytical, troubleshooting, and problem-solving skills.
- Strong leadership and communication skills; ability to train and mentor technical teams.
- Familiarity with data analytics and machine connectivity projects is a plus.
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NXP Semiconductors Romania SRL develops secure connectivity solutions that power embedded applications across various sectors, including automotive, industrial, IoT, mobile, and communication infrastructure. As a leader in the semiconductor industry, NXP is committed to driving innovation for a smarter and more sustainable world.