Lumilens
Lumilens

Principal Mechanical Engineer

TLDR

Lead end-to-end mechanical design and industrialization of OSFP high-speed optical transceiver modules for hyperscale data centers, collaborating across optics, electrical, and manufacturing teams.

Principal Mechanical Engineer – OSFP Module Design

About Lumilens

 

At Lumilens, we are building the critical photonics infrastructure that powers tomorrow’s AI supercomputing. From chip-to-chip optical interconnects to scalable photonic engines, Lumilens is unlocking a new era of computing—faster, cooler, and massively more efficient. Join our experienced team to help shape the next generation of high-speed optical connectivity.

 

Position Summary

We are seeking an experienced Principal Mechanical Engineer to lead the architecture, design, development, and industrialization of next-generation high-speed optical transceiver modules, including 800G, 1.6T, and future pluggable platforms based on the OSFP ecosystem.

 

This role requires deep expertise in high-speed electro-mechanical packaging, thermal management, precision tolerance engineering, EMI/EMC compliance, materials engineering, and large-scale manufacturing/NPI execution. You will work cross-functionally with optics, signal integrity, electrical, thermal, manufacturing, reliability, and supplier teams to deliver high-performance products at hyperscale production volumes.

 

Key Responsibilities

  • Lead end-to-end mechanical design and development of OSFP transceiver modules and related hardware

  • Define module architecture, stack-up strategy, mechanical interfaces, retention mechanisms, heat spreaders, cages, and thermal paths

  • Design precision components using sheet metal, die castings, injection molded plastics, CNC machined parts, and TIMs

  • Optimize designs for thermal performance, structural integrity, EMI shielding effectiveness, manufacturability, reliability, and cost

  • Drive advanced thermal solutions for high-power DSP and optical engines

  • (Optional) Perform thermal simulations using FloTHERM, Icepak, and CFD tools

  • Develop cooling strategies involving heat sinks, vapor chambers, heat spreaders, liquid cooling interfaces, and advanced TIM selection

  • Lead reliability validation including thermal cycling, mechanical shock/drop, vibration, HALT/HASS, and environmental testing

  • Define GD&T strategy and tolerance stack-up analysis for critical thermal and optical interfaces

  • Design EMI shielding solutions including conductive gaskets, coatings, and grounding strategies

  • Drive NPI activities from concept through mass production

  • Establish DFM/DFA guidelines, assembly processes, quality controls, and automation opportunities

  • Lead supplier qualification and manufacturing transfer activities

  • Support yield improvement and root-cause analysis using 8D, DMAIC, Fishbone, and DFMEA/PFMEA

  • Mentor and technically lead engineering teams

 

Required Qualifications

  • Bachelor’s or Master’s degree in Mechanical Engineering or related field

  • 12–20+ years of experience in optical transceivers, networking systems, semiconductor packaging, or data center hardware

  • Strong expertise in OSFP/QSFP mechanical systems, thermal management, and precision design

  • Proficiency in Creo, SolidWorks, or NX CAD tools

  • Strong understanding of GD&T, tolerance analysis, material science, EMI/EMC, and reliability engineering

 

Preferred Qualifications

  • Experience with 800G/1.6T optical modules

  • Knowledge of co-packaged optics or near-packaged optics

  • Experience with copper alloys, Zamak die casting, advanced TIMs, and thermal materials

  • Familiarity with OSFP MSA specifications and high-volume manufacturing models

  • Six Sigma certification or patent publications preferred

 

Key Skills

  • Mechanical architecture leadership

  • Thermal design & simulation (optional)

  • NPI & manufacturing transfer

  • Supplier management

  • Cost optimization / should-cost analysis

  • DFMEA / PFMEA

  • Root cause analysis

  • Program leadership

  • Executive-level technical presentation skills

 

Ideal Background / Industries

  • Optical networking

  • Hyperscale data centers

  • Semiconductor systems

  • Telecom infrastructure

  • AI server platforms

  • High-speed interconnect products

 

What We Offer

  • Competitive salary and significant equity in a high-growth company

  • Comprehensive health, dental, and vision insurance

  • Flexible time off policy

  • Direct impact on groundbreaking technology shaping the future of AI and data centers

  • Opportunity to work with a highly experienced and collaborative team

  • Dynamic and innovative work environment

  • Opportunity for rapid career growth

 

Lumilens is an equal opportunity employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, national origin, disability, or any other protected characteristic.

Benefits

Equity Compensation

significant equity in a high-growth company

Health Insurance

Comprehensive health, dental, and vision insurance

Work environment

Dynamic and innovative work environment

Paid Time Off

Flexible time off policy

Lumilens is focused on building the critical photonics infrastructure needed for tomorrow's AI supercomputing. We develop high-speed optical interconnects and scalable photonic engines that enable faster, cooler, and more efficient computing. With a team of experienced engineers, we are redefining the optical layer of computing, presenting a unique opportunity to tackle some of the toughest challenges in the industry.

Founded
Founded 2024
Employees
51-200 employees
Industry
telecommunications
Funding stage
Series B
Total raised
$39M raised
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