RO61 NXP Semiconductors Romania SRL
Process Engineer
This job is no longer available and isn't accepting applications.
TLDR
Optimize semiconductor backgrind and dicing processes, lead root cause analysis, and support new product introduction and process qualification.
Job Summary:
Seeking a Process Engineer with 3-5 years of semiconductor industry experience in Wafer Saw (Dicing), Backgrind, or DBG processes.
Job Responsibility
- Define/optimize procedures to ensure smooth processing of production lots
- Develop and maintain process documentation and SOPs including operator training
- Lead root cause analysis for defects and yield losses
- Provide disposition on lots with quality issues
- Support new product introduction and process qualification
- Analyze production data to identify process improvements
- Collaborate with cross-functional teams on cost reduction and process improvement projects
- Perform change management including new material qualification
Qualification
- Bachelor's or master's degree in Engineering (Electronics, industrial, Chemical, Mechanical, or related field).
- 3–5 years of process engineering experience with standard backgrind and dicing before grinding (DBG) process.
- Strong data analysis and problem-solving skills.
- Experience with Statistical Process Control (SPC) and process validation (preferred).
- With good command of English language.
- Knowledge of Lean, Six Sigma, or continuous improvement tools (advantage).
NXP Semiconductors Romania SRL develops secure connectivity solutions that power embedded applications across various sectors, including automotive, industrial, IoT, mobile, and communication infrastructure. As a leader in the semiconductor industry, NXP is committed to driving innovation for a smarter and more sustainable world.
- Founded
- Founded 2006
- Employees
- 500+ employees
- Industry
- Semiconductors & Semiconductor Equipment
Process Engineer
No longer accepting applications